Jianzhi Li, Puneet Shrivastava, Zong Gao, and Hong C Zhang (2004)
Printed circuit board recycling: A state-of-the-art survey
IEEE Transactions on Electronics Packaging Manufacturing, 27:33-42.
This survey is done with an intention of providing a clear and comprehensive review of current practices and recent developments in the area of printed circuit boards (PCB) recycling. The aim of this paper is to be a reference for research and implementation for PCB recycling process. Original information is collected from the companies engaged in PCB recycling industry and articles published after 1990. The paper gives an overview of PCB structure, material composition and different recycling processes. © 2004 IEEE.
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